InfraCompute / Deals
DayOne Hong Kong (Kwai Chung) loan
Project loan for DayOne, US$237m, August 2026.
Key terms
- Borrower or issuer
- DayOne
- Date
- August 2026
- Structure
- Project loan
- Amount
- US$237m
- Pricing
- Not disclosed
- Tenor
- 5 years
Recorded terms
- Lender type
- Bank loansNamed lender: DBS
- Tenor
- 5 years
- Lenders and arrangers
- DBS, OCBC, UOB (in talks)
Parties
Similar financings
Same structure, other borrowers, closest in date.
More from DayOne
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Sources
- DayOne Hong Kong (Kwai Chung) loanSource date: 2026-08
About this record
Compiled from the sources above. Terms are as announced and may have changed since. Methodology · Send a correction.
